AS 7017 PERFLUOROELASTOMERS
|COMPOUND CODE||AS 7017|
|EQUIVALENT TO||KALREZ 9100|
AS 7017 is an amber translucent product targeted specifically for PECVD and HD PCVD processes. AS 7000 Series (specially the grades AS 7017 and AS 7027) has a fully fluorinated backbone witch, combined with an unique cross-linking chemistry, enables these compounds to withstand harsh chemical and plasma exposure.
Unlike other perfluoroelastomers, no tin or other metal contaminates detrimental to semiconductor applications are added for vulcanization. It offers very low out gassing as well as excellent elastic recovery and good mechanical strength properties and is well suited for both static and “select” dynamic sealing applications. A maximum continuous service temperature of 300 °C is suggested.
AS 7017 and AS 7027 are the premiers sealing polymers for semiconductor applications for several reasons:
The manufacturing processes for these perfluoroelastomers never adds metallic reagents, fillers or other contaminates to the polymer from its start as a raw material through to final completed seal.
Other standard methods continually add contaminates to the polymer until the seal is completed.
Trace metal analysis of competitive seals, measured in parts per thousand, may reach as high as 10/20 % when metal oxide containing fillers are added.
On the opposite, AS 7017 and AS 7027 trace metal analysis is measured in parts per million with most elements being near or below the detection limit of the most sophisticated analysis.
The compound AS 7017 is a new and innovative chemical resistance Perfluoroelastomer filled with a special semi-crystalline perfluoropolymer filler.
Due to its innovative and unique technology, it allows the manufacturing of translucent items with excellent final properties.
The compound AS 7017 contains a proprietary cure system that improves high temperature performance.
Conventional perfluoroelastomer (FFKM) sealing materials normally contain carbon black and/or mineral fillers. Newer products are either unfilled or formulated with polymeric fillers. Plasma resistance can be significantly different depending on the type of filler used. If the filler has high resistance to plasma, such as BaSO4, TiO2, etc., it can “shield” the polymer to reduce erosion or weight loss, but have the high potential for particle generation by leaving discrete particles behind once the polymer has become etched. Unfilled and polymeric filled products essentially contain no other elements other than carbon, fluorine and oxygen, which can be completely etched to form volatiles, thereby significantly reducing the potential for contamination.
|FEATURES & BENEFITS||APPLICATIONS|
|Excellent final properties without using any metal||Parts for very demanding sealing applications, where no metal and contaminations are specified
HDPCVD, PECVD, SACVD, Metal CVD
Etching, Ashing, Process Applications
Plasma and Gas Deposition
|reinforcer and carbon based fillers|
|Ultra High Purity|
|Ultra low Particle Generation|
|Excellent Chemical Resistance|
|Outstanding Compression-set even at very High Temperature
|excellent thermal stability|
|Excellent elastic recovery and low compression set properties
|Hardness||65||Sh A||DIN 53505|
|100 % modulus||3,0||Mpa||DIN 53504|
|Tensile Strength||16,0||Mpa||DIN 53504|
|Elongation at Break||250||%||DIN 53504|
|Compression Set O-Ring 72h 250 °C||25||%||DIN 53517|
|Minimum/Maximum Operating Temperature||-15/+300°C||°C|